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Aluminum Substrate Copper Clad Laminated Sheet

Ningbo Longsheng Digital Printing Co., Ltd.

Aluminum Substrate Copper Clad Laminated Sheet

Payment Terms : L/C, T/T, D/P, Western Union, Paypal

Delivery Time : within 2-3 working days(depends on your quantity)

Trade Terms : FOB, EXW, CFR, CIF

Min. order : 1 Tons

Sample Price : Depending on exchange rate fluctuations

Place of Origin : china

Category : Copper Strips

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MBCCL Aluminum base copper clad laminated sheet
500*600*1.5mm-1060; Copper 35um, D70um
Thermal conductivity 2.5W/mk
FR-4, FR-1, XPC, CEM-1 Copper Clad Laminated Sheet. It is used for PCB producing in electronics. Standard Size: 1030mm X 1230mm
Aluminum copper clad laminated sheet
AL grade: 1060, 3003, 5052
Thickness: 0.8mm, 1.0mm, 1.2mm. 1.6mm. 2.0mm. 3.0mm
Copper thickness: 1oz, 2oz, 4oz
Size: 500*600mm
IMS Aluminum base copper clad laminated sheet
COPPER CLAD LAMINATED SHEET (CCL)
Characteristic and Application:
1) FR-4 Copper clad laminate/CCL consist of E-glass fabric, impregnated with epoxy resin and clad with electrolytic foil. It has excellent electric, mechanical and flamer retardant properties and is widely used for PWB with printed circuit on one or both side in microwave ovens, computers, communication apparatus as well as other high grade electronic instruments.
2) FR-1copper clad laminated sheet/CCL consist of bleached wood pulp paper, impregnated with flame retardant phenolic-epoxy resin and clad with electrolytic copper foil. It has high electrical stability, good flame retardancy, good dimension stability and smoothness, good punching ability and widely used for Hi-Fi acoustic devices, color TV sets and other electronic appliances.
3) XPC Copper clad laminated sheet/CCL consist of bleached wood pulp paper, impregnated with modified phenolic resin and clad with electrolytic copper foil.
It has high dimension stability, good punching behavior at low temperature, high thermal resistance and are widely used for computers, telephones, Hi-Fi acoustic devices, electronic toys and etc.
4) CEM-1 copper clad laminate consist of bleached wood pulp paper, impregnated with flame retardant epoxy resin and clad with single glass fabric on both sides and electrolytic copper foil.
It has high electrical and electrical strength, good flame retardancy, good dimension stability, lower bow and twist: It is widely used for computers, VCD sets, Hi-Fi acoustic devices and other high grade electronic appliances.
Normal Thickness: 1.0mm, 1.2mm, 1.6mm, 2.0mm
Size Available: 1030 0+2mm X12300+2mm
Note: Different thickness copper foil in one side or double sides can be supplied&
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Item
Test ConditionINDEX
SY-01SY-02SY-03
Thermal
    Conductivity 
    (W/m. k)   
A1~1.51.5~2.02.0~3.0
Peel Strength
(N/mm)     
A
  After thermal stress
≥ 1.8≥ 1.8≥ 1.8
  Blister Test
after Thermal
Stress
A
    After thermal impact

260° C2min
288° C 2min300° C 2min
FlammabilityUL94V-0V-0V-0
Thermal
Resistance 
Max(° C/W)
A≤ 1.2≤ 1.0≤ 0.75
Surface
Resistivity
(MΩ . m)     

A
Constant humidity
            treatment                        (90%, 35 ° C, 96H)
≥ 1× 10 5≥ 1× 10 5≥ 1× 10 6
Volume
Resistivity
  (MΩ . m)       

A
(90%, 35 ° C, 96H)
≥ 1.8× 10 6≥ 1.8× 10 6≥ 1.8× 10 7
Dielectric Breakdown Min (KV)A≥ 2.0≥ 2.5≥ 3.0
Dielectic
Constant
  (1MHz)
(40 ° C, 90%, 96H)≤ 4.4≤ 3≤ 2.5

  Dissipation
      Factor
(40 ° C, 90%, 96H)≤ 0.03≤ 0.03≤ 0.03
&

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